September 17, 1998

Dear Interconnect Specialist,

The Fifth International Conference on Dielectrics for ULSI Multilevel Interconnection (DUMIC) is scheduled for February 8 - 9, 1999 and the Fourth International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnection (CMP-MIC) is scheduled for February 11 - 12, 1999, both at the Santa Clara Marriott Hotel in Santa Clara, CA. As per the attached "Call for Papers", please consider submitting one or more abstracts to these important events.

- IMIC Update -

The new on-chip multilevel interconnection society, the Institute for Microelectronics Inter-connection, or IMIC, is taking shape slowly. There is a lot involved with setting up multi-society not-for-profit corporations. As indicated earlier, there will be five (5) independent sub-societies formulated under the IMIC umbrella in the technological areas of Conductors, Dielectrics, Reliability, C.M.P., and Optical/Novel Interconnections. Each of these sub-societies will have its own governing Board of Directors, Officers, etc. It is planned for next years DUMIC and CMP-MIC to fall under this new IMIC umbrella.

- Phase One: Archival Journal -

Based on your collective inputs, the single most important activity for the new society is the establishment of a dedicated archival journal. Therefore, we are proceeding with the establish-ment of these publications, with Dielectrics and CMP being the first two topical areas. In fact, selected papers for next years DUMIC and CMP-MIC meetings will be included in the Charter Editions of these new archival journals. Many other contributed papers and a few invited papers will also be included, with all papers undergoing a vigorous review process by a editorial panel of experts. More details on these archival journals will be forthcoming soon.

- Act Now -

Fill out the 'Notice of Intent' form attached and fax or mail it in TODAY. Also, if you have colleagues working in this area, encourage them to become involved this year. The due date is October 30, 1998. I look forward to hearing from you as well as seeing you again at DUMIC and/or CMP-MIC in 1999.

Sincerely Yours,

Thomas E. Wade, Ph.D.

General Chairman