DIELECTRICS FOR ULSI MULTILEVEL INTERCONNECTION
---SHORT COURSE--- Wednesday, February 10, 1999

The purpose of this SHORT COURSE is to provide an overview of current research activities for those issues impacting the interlevel DIELECTRICS used in the VLSI/ULSI multilevel interconnection technology. A distinguished set of lecturers will participate in this SHORT COURSE which is a MUST for all engineers, managers and technicians working on VLSI multilevel interconnection. The registration includes coffee breaks, luncheon and a visual booklet.

THIS COURSE HAS LIMITED ENROLLMENT, YOU ARE HIGHLY ENCOURAGED TO ADVANCE REGISTER EARLY.

I.    INTRODUCTORY REMARKS	     8:00 AM
	    Thomas E. Wade
	    Short Course Chairman

II.   INORGANIC DIELECTRICS	     8:05 AM
	    Douglas S. Armbrust
	    IBM Microelectronics; Essex Jct., VT.


	 --Coffee Break--            9:00 AM

III.  ORGANIC DIELECTRICS	     9:15 AM
	    Devendra Kumar
	    FSI International; Fremont, CA.

IV.  LOW k DIELECTRIC RELIABILITY       10:10 AM
	    Harry Rathore & Du Nguyen
	    IBM Microelectronics; Hopewell Jct., NY

V.  DIELECTRIC PROCESS INTEGRATION  11:05 AM
	    Carlye Case
	    ATT Bell Labs/Lucent Technology
	    Murry Hill, New Jersey

	

Luncheon 12:00 PM "SEMICONDUCTOR INDUSTRY LOW k DIRECTIONS" Dr. Max Biberger NOVELLUS SYSTEMS San Jose, California VI. DIELECTRIC PROCESS SIMULATIONS 1:00 PM Valeriy Sukharev LSI Logic; Santa Clara, CA VIII. CLOSING REMARKS 1:50 PM Thomas E. Wade

Short Course registration materials may be picked up at the Registration Desk from 7 - 9:00 AM on Wed., Feb. 10, 1999.

Additional registration - on a space available basis - will be conducted during this time also.

 


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