FINAL CALL FOR PAPERS
FIFTH INTERNATIONAL
CONFERENCE
ON
DIELECTRICS
FOR ULSI MULTILEVEL INTERCONNECTION (DUMIC)
FEBRUARY 8 - 9, 1999
SANTA CLARA
CALIFORNIA
DUMIC CONFERENCE OBJECTIVES
To assemble researchers and technical support personnel from Industry, Universities and Government Laboratories from around the globe to address all current and future issues related to DIELECTRICS for on-chip ULSI Multilevel Interconnection applications.
TOPICAL AREAS
INORGANIC VS. ORGANIC DIELECTRICS (Conventional and/or Novel Materials)
LOW DIELECTRIC CONSTANT OPTIONS
PLANARIZATION ISSUESDIFFUSION BARRIER STUDIES
RELIABILITY, MATERIAL COMPATABILITY, FAILURE/YIELD ANALYSIS PROCESS MODELING AND SIMULATIONS (CAD) STANDARDS FOR ELECTRICAL/MECHANICAL/CHEMICAL EVALUATIONS DEPOSITION/PATTERN DELINEATION TECHNIQUES UNIQUE STRUCTURES, SYSTEMS AND APPLICATIONSABSTRACT SUBMISSION - FOR REGULAR PAPER & POSTER PAPER
A 400 - 500 word abstract with supporting tables/graphs/photos which clearly describes the nature, scope, content, organization and key points of the proposed paper are required for paper selection and session assignment. The name, title and affiliation of authors, complete with return address, telephone and fax number of principal contact should appear on the first page and the paper title and author's name on each subsequent page. Forward two (2) copies of the abstract to be received by November 10, 1998 . Authors will be notified of paper acceptance with instructions for publications by Nov. 25, 1998. Manuscripts are due in final form for publication in the Official DUMIC Conference Proceedings by December 20, 1998. Please obtain clearances prior to sending.
Dr. Thomas Wade
University of South Florida
5316 Witham Court
Tampa, Florida USA 33647-1026
FAX NO: 813/978-3552
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INDICATE TO "DUMIC"
(WITH SUGGESTED TOPICAL AREA)
when subitting abstracts
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