CALL FOR PAPERS

FIFTEENTH INTERNATIONAL
PROCEEDINGS

OF THE

CHEMICAL-MECHANICAL POLISH (CMP)
PLANARIZATION
FOR ULSI MULTILEVEL INTERCONNECTION (CMP-MIC)

MANUSCRIPT DUE DATE: MARCH 15, 2010

CMP-MIC PROCEEDINGS OBJECTIVES

To represent the developments of researchers and technical support personnel from Industry, Universities and Government Laboratories from around the globe to publish current and future issues related to CHEMICAL- MECHANICAL POLISH PLANARIZATION as applied to on-chip ULSI Multilevel Interconnection applications.

PROCEEDINGS TOPICAL AREAS

SUBMIT FULL CAMERA READY MANUSCRIPTS BY MARCH 15, 2010

Submit a ‘Title Page’ (not part of manuscript) with Paper Title and Return Address, Phone Number & Email Address of Principal Contact author.  Also submit Camera Ready Manuscripts which are 6 – 12+ pages in length (including all text, figures, tables, etc.) using standard 8 ˝ X 11 inch paper with 1 inch margin on all sides and a minimum font size of 11. There should be no page numbers (except on back of page in pencil), use only one side of a sheet, use single space text with double spaces between paragraphs, and include figures and tables (must be black and white, no color) either in the text or at the end of the paper. Number equations consecutively in center of pages, and use the following manuscript layout: Title (capitalize and center), Author(s) & Affiliation(s), Abstract (not to exceed 200 words), Text Headings/Sub Headings, Conclusion, References, Appendix (if required). Authors of papers to be published in the Proceedings are to prepay a $25 per page ‘publication page charge’ (six page minimum) and will receive a free copy of the Proceedings after they are published.  Mail, e-mail or fax a copy of the manuscript to be received by March 15, 2010. Authors will be notified of paper acceptance by April 30, 2010.  Please obtain clearances prior to sending manuscript.

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