CONFERENCE
OBJECTIVES
To assemble researchers and
technical support personnel from
Industry, Universities and
Government Laboratories to address
all current and future issues
related to ULSI Multilevel
Interconnection systems.
TOPICAL AREAS
THIS
YEAR’S EMPHASIS: Copper /Ultra-Low-k,
C.M.P., 3D - IC’s, Optical System,
Reliability, Carbon NanoTubes
CONDUCTOR SYSTEMS
(copper interconnects, advanced
barriers, organometallics,
integrated optics, superconductors,
conducting polymers,
refractory/noble & other materials,
etc.)
DIELECTRIC SYSTEMS
(ultra-low-k & high-k materials,
air-bridges, inorganic/organic,
interlevel, passivation)
C.M.P. / PLANARIZATION ISSUES
(processing techniques,
integration, manufacturing,
equipment)
SILICIDES & SALICIDES
(materials, deposition processes,
contact silicidation, etc.
RELIABILITY, FAILURE/YIELD
ANALYSIS, MATERIAL COMPATIBILITY
STUDIES
3-D SYSTEMS / NOVEL PACKAGING
(3-D system on a chip, vertical
integration, wafer level packaging)
MODELING AND SIMULATIONS
(process, equipment, test
structures, performance)
SYSTEM-ON-A-CHIP
(materials, design, processes,
components, integration for SOC)
OPTICAL
INTERCONNECT & NOVEL
ARCHITECTURES/ADVANCED INTERCONNECT
CONCEPTS
ABSTRACT
SUBMISSION - FOR REGULAR PAPER & POSTER
PAPER
