Chemical - Mechanical
PLANARIZATION

    This year’s comprehensive Chemical Mechanical Planarization Short Course  consists of a FULL DAYS ACTIVITIES and will address those issues associated with current fundamental developments in advancing ULSI multilevel interconnection towards greater functionality, density and speed.  It will include a review and discussion of those CMP primary topical areas which impact today’s multilevel interconnection activities as well as project future direction for this critical industry.  A distinguished set of lecturers will participate in this CMP SHORT COURSE, which is a MUST for all engineers, managers and technicians working on VLSI/ULSI multilevel interconnection.  The registration fee includes coffee breaks, luncheon and a visuals booklet.  YOU ARE HIGHLY ENCOURAGED TO ADVANCE REGISTER EARLY TO GUARANTEE YOUR SEAT AT THIS SHORT COURSE.

TOPICAL COVERAGE

I. INTRODUCTORY REMARK - 9:00 A.M.
                           Dr. Thomas E. Wade
                           Short Course Chairman
                           University of South Florida
                           Tampa, Florida

II. CHALLENGES & INNOVATIONS IN METAL SLURRY DEVELOPMENT - 9:15 A.M.
                           Dr. Yuzhuo Li
                           BASF
                           Ludwigshafen, Germany

Coffee Break 10:00 A.M.

III. CHARACTERIZATION TECHNIQUES FOR CMP SOLID CONSUMABLES: How to Expand Beyond Industry Standard Set - 10:15 A.M.
                           Dr. Alexander Tregub
                           Intel Corp
                           Santa Clara, California

IV. MODELING CMP PROCESSES - 11:00 A.M.
                           Dr. Leonard Borucki
                           Araca Inc.
                           Tempe, Arizona