CALL FOR PAPERS
CHEMICAL-MECHANICAL POLISH (CMP)
FOR ULSI MULTILEVEL INTERCONNECTION (CMP-MIC)
MARCH 3 - 6, 2008
CMP-MIC CONFERENCE OBJECTIVES
To assemble researchers and technical support personnel from Industry, Universities and Government Laboratories from around the globe to address all current and future issues related to CHEMICAL- MECHANICAL POLISH PLANARIZATION as applied to on-chip ULSI Multilevel Interconnection and other applications.
DIELECTRIC & METAL CMP PROCESSES & CONTROL
CMP IN-SITU PROCESSING & MONITORING
ELECTRO-CMP PROCESS DEVELOPMENTS
CMP PROCESS INTEGRATION FOR DIELECTRICS & METALS
CONTAMINATION AND (PRE & POST) CLEANING ISSUES; ENVIRONMENTAL IMPACT
CMP CONSUMABLE DEVELOPMENTS (PADS/SLURRIES/ETC.)
EQUIPMENT AND MANUFACTURING ISSUES & MODELING
METROLOGY, CHARACTERIZATION, TEST; MODELING AND SIMULATIONS
CMP STANDARDS DEVELOPMENTS, NEW TECHNOLOGIES & PATENT INFO
ALTERNATIVE GLOBAL PLANARIZATION TECHNIQUES AS COMPARED TO CMP
ABSTRACT SUBMISSION - FOR REGULAR PAPER & POSTER PAPER
A 2 - 3 page Abstract (minimum) with supporting tables/graphs/photos which clearly describes the scope, content and key points of the proposed paper are required for paper selection and session assignment. Indicate how the paper uniquely contributes to the current and future CMP technology. The title, name and affiliation of authors, complete with return address, telephone and e-mail address of principal contact should appear on the first page and the paper title and author's name on each subsequent page. E-mail a copy of the Abstract to be received by January 9, 2008. Authors will be notified of paper acceptance with instructions for publications by January 21, 2008. Manuscripts are due in final form for publication in the Official CMP-MIC Conference Proceedings by February 14, 2008. All Manuscript must be submitted by this deadline date to meet schedule (i.e., late submissions cannot be accepted). Please obtain clearances prior to sending abstract.
|SUBMIT ABSTRACTS (ELECTRONIC VERSIONS) TO:
IMIC Secretary - 5316 Witham Court
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