Short Course 24th VMIC

VLSI MULTILEVEL INTERCONNECTION

STATE-OF-THE-ART

SEMINAR

Monday, September 24, 2007

This year’s state-of-the-art SEMINAR will address those issues associated with current fundamental developments in advancing VLSI/ULSI multilevel interconnection towards greater functionality, density and speed. It will include a review and discussion of those primary topical areas which impact todays multilevel interconnection event as well as project future direction for this critical industry. A distinguished set of lecturers will participate in this SEMINAR, which is a MUST for all engineers, managers and technicians working on VLSI/ULSI multilevel interconnection. The registration fee includes coffee breaks, luncheon and a visuals booklet. THIS COURSE HAS LIMITED ENROLLMENT. YOU ARE ENCOURAGED TO ADVANCE REGISTER EARLY.

TOPICAL COVERAGE

I. INTRODUCTORY REMARKS - 9:00 A.M.

Dr. Thomas E. Wade
Seminar Chairman
University of South Florida

II. C.M.P.:

CMP SOLID CONSUMABLES: Applications, Types, Manufacturing & Characterization - 9:15 A.M.

Dr. Alexander Tregub
Intel Corp.
Santa Clara, California

Coffee Break - 10:00 A.M.

III. C.N.T.:

CARBON NANOFIBER INTERCONNECTS - 10:15 A.M.

Dr. Cary Y. Yang
Santa Clara University
Santa Clara, California

IV. LITHOGRAPHY:

ADVANCED LITHOGRAPHY TECHNIQUES AND ISSUES - 11:00 A.M.

Dr. Nicholas Eib
DSM Solutions
Los Gatos, California

Seminar Luncheon 12:00 P.M.

“SILICON PHOTONICS:
OPPORTUNITIES AND CHALLENGES
FOR INTERCONNECTS”

Dr. Mario Paniccia

INTEL CORPORATION

San Clara, California

V. LOW - k DIELECTRICS:

LOW - k & ULTRA LOW - k DIELECTRIC MATERIALS & CHALLENGES - 1:15 P.M.

Dr. Willi Volksen
IBM Almaden Research Center
Santa Clara, California

VI. AIR - GAPS:

DEVELOPING AIR-GAP TECHNOLOGY FOR INTERCONNECTS - 2:00 P.M.

Dr. Paul Kohl
Georgia Institute of Technology
Atlanta, Georgia

Coffee Break - 2:45 P.M.

VII. 3-D INTEGRATED CIRCUITS:

WAFER-LEVEL 3-D IC’s: TECHNOLOGY PLATFORMS & APPLICATIONS - 3:00 P.M.

Dr. Ronald Gutmann
Rensselaer Polytechnic Institute
Troy, New York

VIII. HIGH-k DIELECTRICS:

ADVANCES IN HIGH - k DIELECTRIC MATERIALS - 3:45 P.M.

Dr. Ravi Laxman
Air Liquide Electronics
Fremont, California

IX. CLOSING REMARKS - 4:30 P.M.

Short Course registration materials may be picked up at the Registration Desk from 7 - 10 A.M. on Monday, September 24, 2007.

Additional at-door registrations will be conducted during this time as well.