“Paradigm Shift in Interconnect Technology: Direct
Assembly of Single-Walled Carbon NanoTube and
NanoParticle Interconnect”
Ahmed Busnaina
NSF NanoScience & Engr. Crt.
Keynote Address - 1

 

“Challenges With Higher Degree of Integration”
T. M. Mak
Intel Corp
Keynote Address 2

 

“Silicon Processing Technologies in Adjacent Space:
Applications Beyond Information Technology”
Nicholas Fuller & Timothy Dalton
IBM Watson Research Center
Keynote Address - 3

 

“Silicon Photonics: Opportunities and Challenges
for Interconnects”
Mario Paniccia
Intel Corp.
State-of-the-Art Seminar Luncheon

 

“3-D System Integration, Challenges
And Opportunities”
Eric Beyne
IMEC
Leuven, Belgium

+

“‘Interconnect Society’ Within the IEEE -
Long Overdue”
Thomas E. Wade
General Chairman
VMIC Awards Luncheon

 

3-D IC KEYNOTE PANELS: “Research Challenges
In 3–D IC Realization / Integration” with 7 Panelist