Chemical - Mechanical

PLANARIZATION

FOR ULSI MULTILEVEL INTERCONNECTION

- SHORT COURSE -

 Monday, March 5, 2007

    This year’s comprehensive Chemical Mechanical Planarization Short Course  consists of a FULL DAYS ACTIVITIES and will address those issues associated with current fundamental developments in advancing ULSI multilevel interconnection towards greater functionality, density and speed.  It will include a review and discussion of those CMP primary topical areas which impact today’s multilevel interconnection activities as well as project future direction for this critical industry.  A distinguished set of lecturers will participate in this CMP SHORT COURSE, which is a MUST for all engineers, managers and technicians working on VLSI/ULSI multilevel interconnection.  The registration fee includes coffee breaks, luncheon and a visuals booklet.  YOU ARE HIGHLY ENCOURAGED TO ADVANCE REGISTER EARLY TO GUARANTEE YOUR SEAT AT THIS SHORT COURSE.

 

TOPICAL COVERAGE

 

I.             INTRODUCTORY REMARK                 9:00 A.M.
                               Dr. Thomas E. Wade
                               Short Course Chairman
                               University of South Florida
                               Tampa, Florida 

II.            EVOLUTION OF CMP                            9:15 A.M.
                                 Dr. Robert Rhoades
                                 Entrepix
                                Tempe, AZ

                                    Coffee Break                10:00 A.M.

III.           CHARACTERIZATION OF SOLID CONSUMABLES FOR CMP: Unknown Known

                 Or Known Unknowns?            10:15 A.M.
                                Dr. Alexander Tregub
                                 Intel Corp
                                Santa Clara, CA

 

IV.            CHALLENGES & INNOVATIONS IN
                   METAL SLURRY DEVELOPMENT   11:00 A.M.
                                 Dr. Yuzhuo Li
                                  Clarkson University
                                 Potsdam, New York
 

                      Short Course Luncheon    12:00 P.M.

“MEGA MARKET TRENDS IN
SEMICONDUCTOR CONSUMABLES
& CHEMICAL-MECHANICAL POLISH”

Dr. Steve Holland
Techcet LLC
Genoa, Nevada

 

V.              SURFACE SCRATCHES IN CMP:
                    Mechanics & Materials                     1:45 P.M
                              Dr. Nannaji Saka, J.-H. Chun & T. Eusner
                              Massachusetts Inst. of Tech.
                              Cambridge, MA

VI.             CMP ENDPOINT PROCESSES                2:30 P.M.
                            Dr. John  Givens
                            Innovative Materials Group, Inc.
                            Austin, TX 

                             Coffee Break                             3:15 P.M.

VII.            POST CMP DEFECTS                             3:30 P.M.
                           Dr. Paul LeFevre
                           Fujimi Corp
                           Tualatin, OR

  

VIII.           OVERALL CMP MATERIAL TRENDS
                   AND TECHNOLOGY                         4:15 P.M.
                             Dr. Karey Holland
                             Techcet LLC
                            Genoa, NV

 

IX.                CLOSING REMARKS                           5:00 P.M.

  

     Short Course registration materials may be picked up at the Registration Desk from 7 - 10 A.M. on Monday, March 5, 2007.

     Additional at-door registrations will be conducted during this time as well.

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