Sept 2005 22th VMIC Conf.

Welcome to the 2006 VMIC Conference

TWENTY THIRD INTERNATIONAL VLSI/ULSI MULTILEVEL INTERCONNECTION
CONFERENCE, STATE-OF-THE-ART SEMINAR AND EXHIBITION

Fremont Marriott
Fremont, California
September 25 - 28, 2006
Hotel Registration

VMIC
(23rd International Conference)
FOR VLSI/ULSI MULTILEVEL
INTERCONNECTION
September 25 - 28, 2006

STATE-OF-THE-ART SEMINAR
September 25, 2006

Registration Information

Registration Form

HIGHLIGHTS:
“Advancing Silicon Scaling: 65 nm Technology & Challenges Beyond” Peng Bai; INTEL CORP. Keynote Address - 1 “New Dimensions in Performance” Kerry Bernstein; IBM WATSON RES. CTR. Keynote Address - 2 “BEOL Integration for 45 & 32 nm Nodes: Challenges And Solutions” Roey Shaviv; NOVELLUS CORP. Keynote Address - 3 “3-D Integrated Circuits: Myths and Motives” Susan Vitkavage; SEMATECH Keynote Address - 4 “Competing Technologies for 32 nm Generation” Pete Singer; Semiconductor International, Chief Editor VMIC Awards Luncheon (Thursday @ Noon) Three KEYNOTE PANELS: - 3-D IC’s (IBM, UCLA, TSMC, MIT, Tezzaron, Stanford) - Copper/Ultra-Low-k (IBM, ST Micro, SEMATECH) - Pattern & Lithography (LSI Logic, Info Net, Lam Res)

HIGHLIGHTS:

“Advancing Silicon Scaling: 65 nm Technology & Challenges Beyond”
Peng Bai; INTEL CORP.
Keynote Address - 1

“New Dimensions in Performance”
Kerry Bernstein; IBM WATSON RES. CTR.
Keynote Address - 2

“BEOL Integration for 45 & 32 nm Nodes:
Challenges And Solutions”
Roey Shaviv; NOVELLUS CORP.
Keynote Address - 3

“3-D Integrated Circuits: Myths and Motives”
Susan Vitkavage; SEMATECH
Keynote Address - 4

“Competing Technologies for 32 nm Generation”
Pete Singer; Semiconductor International, Chief Editor
VMIC Awards Luncheon (Thursday @ Noon)

Three KEYNOTE PANELS:

     - 3-D IC’s    (IBM, UCLA, TSMC, MIT, Tezzaron, Stanford)

     - Copper/Ultra-Low-k     (IBM, ST Micro, SEMATECH)

      - Pattern & Lithography    (LSI Logic, Info Net, Lam Res)

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