IMIC
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IMIC |
FINAL CALL FOR PAPERS
TWENTY THIRD INTERNATIONAL
VLSI MULTILEVEL INTERCONNECTION (VMIC)
CONFERENCE, SHORT COURSE & EXHIBITION
(The Original Interconnect Conference)
September 25 - 28,
2006FREMONT
CONFERENCE OBJECTIVES
To assemble researchers and technical support personnel from Industry, Universities and Government Laboratories to address all current and future issues related to ULSI Multilevel Interconnection systems.
TOPICAL AREAS
THIS YEAR’S EMPHASIS: Copper / Ultra-Low-k Systems, C.M.P., 3D-I.C.’s, Optical Sys, Reliability
CONDUCTOR SYSTEMS
(copper interconnects, advanced barriers, organometallics, integrated optics, superconductors, conducting polymers, refractory/noble & other materials, etc.)DIELECTRIC SYSTEMS ( ultra-low-k & high-k materials, inorganic and organic, interlevel or passivation)
C.M.P. / PLANARIZATION ISSUES (processing techniques, integration, manufacturing, equipment)
SILICIDES & SALICIDES (materials, deposition processes, contact silicidation, etc.)
RELIABILITY, FAILURE/YIELD ANALYSIS, MATERIAL COMPATIBILITY STUDIES
NOVEL PACKAGING/3-D SYSTEMS (wafer level packaging, 3-D system on a chip, vertical integration)
MODELING AND SIMULATIONS (process, equipment, test structures, performance)
SYSTEM-ON-A-CHIP (materials, design, processes, components, integration of SOC,etc.)
PROCESS INTEGRATION & NOVEL ARCHITECTURES / ADVANCED INTERCONNECT CONCEPTS
ABSTRACT SUBMISSION - FOR REGULAR PAPER & POSTER PAPER
A two (2) page abstract with supporting tables/graphs/photos which clearly describes the nature, scope, and new results which advance the art of the proposed paper are required for paper selection. Suggest a specific technical area for session assignment. The name, title and affiliation of authors, complete with return address, telephone and fax numbers, e-mail address of principal contact should appear on the first page and the paper title and author’s name on each subsequent page. E-mail a copy of the abstract to be received by JULY 18, 2006. Authors will be notified of paper acceptance with instructions for publication by August 4, 2006. Manuscripts are due in final form for publication in the official VMIC Conference Proceedings by August 25, 2006 (to be available at the meeting).
Please obtain clearance prior to sending.
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SUBMIT ABSTRACTS TO: Tampa, Florida USA 33647-1026 FAX (813) 978 - 3552 email: wade@eng.usf.edu Deadline: JULY 18, 2006 |
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