Chemical - Mechanical
PLANARIZATION
FOR ULSI MULTILEVEL
INTERCONNECTION
- SHORT COURSE -
This
year’s comprehensive Chemical Mechanical Planarization Short
Course consist of a FULL DAYS
ACTIVITIES and will address those issues associated with current
fundamental developments in advancing ULSI multilevel interconnection
towards greater functionality, density and speed. It will include a review and discussion of
those CMP primary topical areas which impact todays
multilevel interconnection activities as well as project future direction for
this critical industry. A distinguished
set of lecturers will participate in this CMP SHORT COURSE, which is a MUST for
all engineers, managers and technicians working on VLSI/ULSI multilevel
interconnection. The registration fee
includes coffee breaks, luncheon and a visuals booklet. YOU ARE HIGHLY ENCOURAGED TO ADVANCE
REGISTER EARLY TO GUARANTEE YOUR SEAT AT THIS SHORT COURSE.
TOPICAL COVERAGE
I. INTRODUCTORY REMARKS
-
Dr. Thomas E.
Wade
Short
Course Chairman
II. INNOVATIVE
APPROACHES IN METAL
CMP SLURRY
DEVELOPMENT
-
Dr. Yuzhuo Li
Coffee
Break
-
FOR SUB-MICRON
I.C.’s
-
Dr. David
Dornfeld
IV. NOVEL APPLICATION
IN CMP
-
Dr. Martin Kulawski
VTT Microelectronics
Short Course Luncheon
-
Dr.
Karey Holland
V.
CMP TRIBOLOGICAL ATTRIBUTES
-
Dr. Ara Philipossian
VI. IN-SITU CMP
PROCESSES
-
&
Caprice Gray
Coffee
Break
-
VII. COPPER ELECTROCHEMICAL
PLANARIZATION
PROCESSES
-
American AirLiquide
Countryside, IL
VIII. POST-CLEANING METHODS FOR CMP
-
ATMI
IX. CLOSING REMARKS
-
from
Additional at-door registrations will be
conducted during this time as well.
IMIC Home - Conference Home - IMIC Contact
Copyright © 2006 IMIC. All rights reserved.