From time to time, the IMIC organization may hold a "Specialty Conference"
on a subtopic of VLSI Multilevel Interconnection (i.e., dielectrics,
conductors, planarization, reliability, simulation & modeling, etc.).
These "Specialty Conferences" are held in addition to the annual VMIC
meeting, normally held in September. "Specialty Conferences" allow an
in-depth look and evaluation of various VMIC sub-areas.
February 20, 2006
HIGHLIGHTS:
“Will CMP Continue to
Enable Future Technologies?”
KEY PANEL I: “What are
the Key Issues for CMP at 45nm?”
CMP - SHORT COURSE:
Fremont, California
46100 Landing Parkway
Feb. 20 - 23, 2006
Hotel Registration
(Eleventh International Conference)
FOR ULSI MULTILEVEL
INTERCONNECTION
Feb. 20 - 23, 2006
SHORT COURSE
CMP Planarization
http://www.imic.org
Registration Information
Registration Form
HIGHLIGHTS
Dr. Joseph M. Steigerwald, Intel Corp.
CMP Keynote
Address
Panel Members:
V. Souw, Intel; K. Sahota, Spansion/AMD;
J. Farkas, Freescale; C. Spiro, Cabot Micro; D. Boning, MIT;
M. Smayling, Applied Materials; B. Brown, Novellus.
CMP-MIC
Key Panel I KEY PANEL II: “Emerging
Technologies for CMP”
Panel
Members: P. Fischer, Intel; U. Stoeckgen, AMD;
N. Chandrasekaran, Micron; P. Feeney, Cabot Micro;
C. Markham, Rohm Haas; H.H. Lu, TSMC.CMP-MIC Key Panel II
KEY PANEL III: “Current & Future Needs for CMP Metrology”
Panel Members: J. Witowski, KLA-Tencor; D. Fong, Veeco;
L. Bond, ADE; R. Newcomb, Filmtrics; L.Wu, Timbre;
J. Santucci, Nova; M. Wedlake, Spansion.
CMP-MIC Key Panel III“In Search of
Better Business Models for
Electronic Materials”
Michael A. Fury; EKC Technology
CMP-MIC Awards
Luncheon“MegaTrends
for the
Materials & CMP Market”
Karey Holland; Techcet, LLC
CMP Short
Course Luncheon
Full Day -
7 Expert Lecturers
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