|
IMIC |
CALL FOR PAPERS
ELEVENTH INTERNATIONAL
CONFERENCE
ON
CHEMICAL-MECHANICAL POLISH (CMP)
PLANARIZATION
FOR ULSI MULTILEVEL INTERCONNECTION (CMP-MIC)
FEBRUARY 20 - 23, 2006
FREMONT
MARRIOTT
FREMONT, CALIFORNIA
CMP-MIC CONFERENCE OBJECTIVES
To assemble researchers and technical support personnel from Industry, Universities and Government Laboratories from around the globe to address all current and future issues related to CHEMICAL- MECHANICAL POLISH PLANARIZATION as applied to on-chip ULSI Multilevel Interconnection applications.
TOPICAL AREAS
DEVELOPMENTS IN
DIELECTRIC & METAL CMP PROCESSES & CONTROL
CMP IN-SITU PROCESSING & MONITORING
ELECTRO-CMP PROCESS DEVELOPMENTS
CMP PROCESS INTEGRATION FOR DIELECTRICS & METALS
CONTAMINATION AND (PRE & POST) CLEANING ISSUES
CMP CONSUMABLE DEVELOPMENTS (PADS/SLURRIES/ETC.)
EQUIPMENT AND MANUFACTURING ISSUES & MODELING
METROLOGY, CHARACTERIZATION, TEST; MODELING AND SIMULATIONS
CMP STANDARDS DEVELOPMENTS, NEW TECHNOLOGIES & PATENT INFO
ALTERNATIVE GLOBAL PLANARIZATION TECHNIQUES AS COMPARED TO CMP
ABSTRACT SUBMISSION - FOR REGULAR PAPER & POSTER PAPER
A 400 - 500 word abstract with supporting tables/graphs/photos which clearly describes the nature, scope, content, organization and key points of the proposed paper are required for paper selection and session assignment. The title, name and affiliation of authors, complete with return address, telephone and fax number of principal contact should appear on the first page and the paper title and author's name on each subsequent page. Mail, E-mail or fax a copy of the abstract to be received by December 12, 2005. Authors will be notified of paper acceptance with instructions for publications by Dec. 19, 2005. Manuscripts are due in final form for publication in the Official CMP-MIC Conference Proceedings by Jan. 13, 2006. All Manuscript must be submitted by this deadline date to meet schedule. Please obtain clearances prior to sending abstract.
| SUBMIT ABSTRACTS TO: IMIC Secretary - 5316 Witham Court |
IMIC Home - Conference Home - IMIC Contact
Copyright © 2006 IMIC. All rights reserved.