Tuesday, February 22, 2005

This year’s comprehensive Chemical Mechanical Planarization Short Course consist of a FULL DAYS ACTIVITIES and will address those issues associated with current fundamental developments in advancing ULSI multilevel interconnection towards greater functionality, density and speed. It will include a review and discussion of those CMP primary topical areas which impact todays multilevel interconnection activities as well as project future direction for this critical industry. A distinguished set of lecturers will participate in this CMP SHORT COURSE, which is a MUST for all engineers, managers and technicians working on VLSI/ULSI multilevel interconnection. The registration fee includes coffee breaks, luncheon and a visuals booklet. YOU ARE HIGHLY ENCOURAGED TO ADVANCE REGISTER EARLY TO GUARANTEE YOUR SEAT AT THIS SHORT COURSE.

TOPICAL COVERAGE

I. INTRODUCTORY REMARKS

Dr. Thomas E. Wade

Short Course Chairman

University of South Florida

Tampa, Florida

II. COPPER SLURRY DEVELOPMENTS

Dr. Yuzhuo Li

Clarkson University

Potsdam, New York

Coffee Break

III. INTEGRATED MODELING OF CMP

FOR SUB-MICRON IC’s

Dr. David Dornfeld

University of California

Berkeley, California

IV. MECHANISMS & METHODS OF COPPER

ELECTROCHEMICAL PLANARIZATION

Dr. Jinshan Huo

American AirLiquide

Countryside, Illinois

Short Course Luncheon

“MATERIALS CHALLENGES IN FUTURE

INTEGRATED CIRCUITS TECHNOLOGIES”

Dr. Mansour Moinpour

Intel Corporation

Santa Clara, California

V. CMP DESIGN FOR MANUFACTURING ISSUES

Dr. Andrew Kahng &

Dr. Puneet Gupta

University of California

San Diego, California

VI. TRIBOLOGY ISSUES IN CMP

Dr. Norm Gitis

Center for Tribology

Campbell, California

Coffee Break

VIII. RECENT DEVELOPMENTS IN

CMP METROLOGY

Dr. Arun Chatterjee

KLA-TENCOR CORP.

San Jose, California

VII. FUTURE CMP NEEDS

Dr. David Stein

Sandia National Laboratory

Albuquerque, New Mexico

VIII. CLOSING REMARKS

Short Course registration materials may be picked up at the Registration Desk from 7 - 10 A.M. on Tuesday, February 22, 2005.

Additional at-door registrations will be conducted during this time as well.