CALL FOR PAPERS

 TENTH INTERNATIONAL

CONFERENCE

ON

CHEMICAL-MECHANICAL POLISH (CMP)

PLANARIZATION

FOR ULSI MULTILEVEL INTERCONNECTION (CMP-MIC)

FEBRUARY 22 - 25, 2005

FREMONT

MARRIOTT

FREMONT, CALIFORNIA

CMP-MIC CONFERENCE OBJECTIVES

To assemble researchers and technical support personnel from Industry, Universities and Government Laboratories from around the globe to address all current and future issues related to CHEMICAL- MECHANICAL POLISH PLANARIZATION as applied to on-chip ULSI Multilevel Interconnection applications.

TOPICAL AREAS

        DEVELOPMENTS IN DIELECTRIC & METAL CMP PROCESSES & CONTROL
        MODELING AND SIMULATION;  THEORY
        CMP PROCESS INTEGRATION FOR DIELECTRICS & METALS
        CONTAMINATION AND (PRE & POST) CLEANING ISSUES
        CMP CONSUMABLE DEVELOPMENTS (PADS/SLURRIES/ETC.)
        EQUIPMENT AND MANUFACTURING ISSUES
        CHARACTERIZATION AND TEST
        CMP STANDARDS DEVELOPMENTS
        ALTERNATIVE GLOBAL PLANARIZATION TECHNIQUES AS COMPARED TO CMP

ABSTRACT SUBMISSION - FOR REGULAR PAPER & POSTER PAPER

A 400 - 500 word abstract with supporting tables/graphs/photos which clearly describes the nature, scope, content, organization and key points of the proposed paper are required for paper selection and session assignment.  The title, name and affiliation of authors, complete with return address, telephone and fax number of principal contact should appear on the first page and the paper title and author's name on each subsequent page.  Mail, E-mail or fax a copy of the abstract to be received by December 14, 2004. Authors will be notified of paper acceptance with instructions for publications by Dec. 14, 2004.  Manuscripts are due in final form for publication in the Official CMP-MIC Conference Proceedings by January 18, 2005. Please obtain clearances prior to sending abstract.