Rich Baker, ROHM & HAAS

Peter Burke, LSI LOGIC

Timothy Cale, RPI

Raymond Carey, INTEL

Paul Feeney, CABOT MICRO

Mike Fury, EKC TECH.

Jose Luis Hernandez, IMEC

Dale Hetherington, SANDIA NAT’L LAB

Richard Huang, AMD

Akira Isobe, TOKYO SEIMITSU

Seiichi Kondo, SELETE JAPAN

Rakesh Kumar, IME SINGAPORE

Mansour Moinpour, INTEL

Takeshi Nishioka, TOSHIBA

Endou Nobuhiro, SELETE JAPAN

Takeshi Nogami, SONY

Shoso Shingubara, HIROSHIMA U

Yutaka Uda, NIKON JAPAN

Peter Thieme, INFINEON

Thomas Wade, U. SOUTH FLA.

Subramaniam Balakumar, IME SINGAPORE

Eric Beach, TEXAS INSTRUMENTS

Ralph Brandes, DEGUSSA

Robert Castellano, INFORMATION NETWORK

John Cheney, FUJIMI

Katia Devriendt, IMEC

David Dornfeld, U.C. BERKELEY

Fiona Doyle, U.C. BERKELEY

Janos Farkas, MOTOROLA

Kenneth Foster, EXATEC

John Gagliardi, 3 M COMPANY

Tamba Gbondo-Tugbawa, PRAESAGUS

David Hansen NOVELLUS

Matt Healy, ATMI

Stuart Hellring, PPG

Masataka Hoshino, ASET JAPAN

Yoshio Homma, CASMAT JAPAN

Wei-Yung Hsu, APPLIED MAT’L

Jiangtao Hu, NANOMETRICS

Eugene Ivanov, TOSOH SMD

John Janzen, HONEYWELL
 

Martin Kulawski, VTT FINLAND

Scott Lantz, INTEL

Yuzhuo Li, CLARKSON U

James Lu, RPI

Jianfeng Luo, UC BERKELEY

John Mendonca, APPLIED MAT’L

Mark Merrill, KLA-TENCOR

Michael Oliver, ROHM & HAAS

Ara Philipossian, U ARIZONA

Srini Raghaven, U ARIZONA

Anantha Sethuraman, FEI CO

Robert Small, EKC TECH

Konstantin Smekalin, APPLIED MAT

Laura Stearns, SEAGATE

David Stein, SANDIA NAT’L LABS

James Sung, KINIK

Tuyen Vo, TESSELLATION

Guangwei Wu, THOMAS WEST

Jerry Yang, ROHM & HAAS

Akihiko Yamane, TOKYO SEIMITSU

Tao Zhang, JAZZ SEMI