IMIC
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IMIC |
Final
CALL FOR PAPERS
NINTH INTERNATIONAL
CONFERENCE
ON
CHEMICAL-MECHANICAL POLISH (CMP)
PLANARIZATION
FOR ULSI MULTILEVEL INTERCONNECTION (CMP-MIC)
FEBRUARY 23 - 26, 2004
MARINA DEL REY
MARRIOTT
CALIFORNIA
CMP-MIC CONFERENCE OBJECTIVES
To assemble researchers and technical support personnel from Industry, Universities and Government Laboratories from around the globe to address all current and future issues related to CHEMICAL- MECHANICAL POLISH PLANARIZATION as applied to on-chip ULSI Multilevel Interconnection applications.
TOPICAL AREAS
DEVELOPMENTS IN DIELECTRIC & METAL CMP PROCESSES & CONTROL
CMP IN-SITU PROCESSING & MONITORING
MODELING AND SIMULATION; THEORY
CMP PROCESS INTEGRATION FOR DIELECTRICS & METALS
CONTAMINATION AND (PRE & POST) CLEANING ISSUES
CMP CONSUMABLE DEVELOPMENTS (PADS/SLURRIES/ETC.)
EQUIPMENT AND MANUFACTURING ISSUES & MODELING
METROLOGY, CHARACTERIZATION AND TEST
CMP STANDARDS DEVELOPMENTS, NEW TECHNOLOGIES & PATENT INFO
ALTERNATIVE GLOBAL PLANARIZATION TECHNIQUES AS COMPARED TO CMP
ABSTRACT SUBMISSION - FOR REGULAR PAPER & POSTER PAPER
A 400 - 500 word abstract with supporting tables/graphs/photos which clearly describes the nature, scope, content, organization and key points of the proposed paper are required for paper selection and session assignment. The title, name and affiliation of authors, complete with return address, telephone and fax number of principal contact should appear on the first page and the paper title and author's name on each subsequent page. Mail, E-mail or fax a copy of the abstract to be received by December 15, 2003. Authors will be notified of paper acceptance with instructions for publications by Dec. 22, 2003. Manuscripts are due in final form for publication in the Official CMP-MIC Conference Proceedings by Jan. 19, 2004. All Manuscript must be submitted by this deadline date to meet schedule. Please obtain clearances prior to sending abstract.
| SUBMIT ABSTRACTS TO: IMIC Secretary - 5316 Witham Court |
2004 CMP-MIC COMMITTEES
EXECUTIVE COMMITTEE
|
Rich Baker, RODEL Peter Burke, LSI LOGIC Raymond Carey, INTEL Mike Fury, EKC TECH. Jose Luis Hernandez, IMEC Dale Hetherington, SANDIA NAT’L LAB Richard Huang, APPLIED MAT’L |
Akira Isobe,
TOKYO SEIMITSU Seiichi Kondo, SELETE JAPAN Mansour Moinpour, INTEL Takeshi Nishioka, TOSHIBA Takeshi Nogami, SONY Yutaka Uda, NIKON JAPAN Thomas Wade, U. SOUTH FLA. |
PROGRAM COMMITTEE
|
Eric Beach, TEXAS INSTRUMENTS Ralph Brandes, DEGUSSA Katia Devriendt, IMEC David Dornfeld, U.C. BERKELEY Fiona Doyle, U.C. BERKELEY Janos Farkas, MOTOROLA Paul Feeney, CABOT MICRO. Kenneth Foster, DOW CHEMICAL John Gagliardi, 3 M COMPANY Tamba Gbondo-Tugbawa, PRAESAGUS David Hansen NOVELLUS Matt Healy, ATMI Stuart Hellring, PPG Wei-Yung Hsu, APPLIED MAT’L Eugene Ivanov, TOSOH SMD John Janzen, HONEYWELL Rakesh Kumar, IME SINGAPORE Masataka Hoshino, ASET JAPAN |
Scott Lantz,
INTEL Yuzhuo Li, CLARKSON U. James Lu, R. P. I. Jianfeng Luo, U.C. BERKELEY Mark Merrill, KLA-TENCOR Endou Nobuhiro, SELETE Ara Philipossian, U. ARIZONA Srini Raghaven, U. ARIZONA Anantha Sethuraman, FEI CO. Shoso Shingubara, HIROSHIMA U. Robert Small, EKC TECH. Laura Stearns, SEAGATE David Stein, SANDIA LABS Peter Thieme, INFINEON Guangwei Wu, THOMAS WEST Jerry Yang, RODEL Akihiko Yamane, TOKYO SEIMITSU Tao Zhang, JAZZ SEMI. |
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