VLSI  MULTILEVEL  INTERCONNECTION
STATE-OF-THE-ART
SEMINAR

Monday, September 22, 2003

This year’s state-of-the-art SEMINAR will address those issues associated with current fundamental developments in advancing VLSI/ULSI multilevel interconnection towards greater functionality, density and speed.  It will include a review and discussion of those primary topical areas which impact today's multilevel interconnection event as well as project future direction  for this critical industry.  A distinguished set of lecturers will participate in this SEMINAR, which is a MUST for all engineers, managers and technicians working on VLSI/ULSI multilevel interconnection.  The registration fee includes coffee breaks, luncheon and a visuals booklet. THIS COURSE HAS LIMITED ENROLLMENT.  YOU ARE ENCOURAGED TO ADVANCE REGISTER EARLY.

TOPICAL COVERAGE

 I.  INTRODUCTORY REMARKS ( 9:00 A.M.)
Dr. Thomas E. Wade
Seminar Chairman
University of South Florida

II.  DIELECTRICS:  (9:15 A.M.)
ADVANCES IN LOW-k & ULTRA LOW-k
POROUS DIELECTRICS
Dr. Willi Volksen
IBM Almaden Research Center
San Jose, California

III.  COPPER INTERCONNECTS:
ADVANCE COPPER TECHNOLOGY  (10:15 A.M.)
DEVELOPMENTS
Dr. Maximilian Biberger
Supercritical Systems Inc.
Gilbert, Arizona

 IV.  RELIABILITY: (11:00 A.M.)
RELIABILITY ISSUES IN ADVANCED
COPPER TECHNOLOGY
Dr. Young-Joon Park
Texas Instruments
Dallas, Texas 

Seminar Luncheon (12:00 P.M.)
“LOW-k DIELECTRICS FOR THE
90 NANOMETER NODE AND BEYOND"
Dr. Devendra Kumar
ASM CORP.
San Jose, California 

V.  THERMAL EFFECTS: (1:45 P.M.)
THERMAL ISSUES IN DESIGNING NANO-
METER SCALE INTERCONNECTS
Dr. Kaustav Banerjee
University of California
Santa Barbara, California

 VI.  CMP: (2:30 P.M.)
 CHEMICAL-MECHANICAL PLANARIZATION
INTEGRATION ISSUES
Dr. Katia Devriendt   &  Dr. David Stein
    IMEC                               Sandia Nat’l Labs
     Leuven, Belgium             Albuquerque, NM.

 Coffee Break (3:15 P.M.)

VII.  3-D INTEGRATED CKTS: (3:30 P.M.)
 ADVANCES IN THREE-DIMENSIONAL
INTEGRATED CIRCUITS
Dr. Ronald Gutmann
Rensselaer Polytechnical Institute
Troy, New York

VIII.  METROLOGY: (4:15 P.M.)
DEVELOPMENTS IN INSPECTION &
METROLOGY METHODS
Dr. Anantha Sethuraman
FEI Company
Sunnyvale, California

IX.   CLOSING REMARKS   ( 5:00 P.M.)