18th VLSI Call for Papers

FINAL CALL FOR PAPERS

TWENTIETH INTERNATIONAL
VLSI MULTILEVEL INTERCONNECTION (VMIC)
CONFERENCE, SHORT COURSES & EXHIBITION
(The Original Interconnect Conference)

SEPTEMBER 22 - 25, 2003

Marina del Rey

MARRIOTT HOTEL

California

CONFERENCE OBJECTIVES

To assemble researchers and technical support personnel from Industry, Universities and Government Laboratories to address all current and future issues related to ULSI Multilevel Interconnection systems.

TOPICAL AREAS

THIS YEAR’S EMPHASIS: Copper / Ultra-Low-k Systems, C.M.P., Packaging, Reliability, Optical System

CONDUCTOR SYSTEMS (copper interconnects, advanced barriers, organometallics, integrated optics, superconductors, conducting polymers, refractory/noble & other materials, etc.)

DIELECTRIC SYSTEMS ( ultra-low-k & high-k materials, inorganic and organic, interlevel, ARC or passivation)

C.M.P. / PLANARIZATION ISSUES (processing techniques, integration, manufacturing, equipment)

SILICIDES & SALICIDES (materials, deposition processes, contact silicidation, etc.)

RELIABILITY, FAILURE/YIELD ANALYSIS, MATERIAL COMPATIBILITY STUDIES

NOVEL PACKAGING/3-D SYSTEMS (wafer level packaging, 3-D system on a chip, vertical integration)

MODELING AND SIMULATIONS (process, equipment, test structures, performance)

SYSTEM-ON-A-CHIP (materials, design, processing, components, integration of SOC)

PROCESS INTEGRATION & NOVEL ARCHITECTURES/ADVANCED INTERCONNECT CONCEPTS

A 300 - 500 word abstract with supporting tables/graphs/photos which clearly describes the nature, scope, content, organization and key points of the proposed paper are required for paper selection and session assignment. The name, title and affiliation of authors, complete with return address, telephone and fax numbers, e-mail address of principal contact should appear on the first page and the paper title and author’s name on each subsequent page. Mail, E-mail or fax a copy of the abstract to be received by JULY 21, 2003. Authors will be notified of paper acceptance with instructions for publication by July 28, 2003. Manuscripts are due in final form for publication in the official VMIC Conference Proceedings by Aug. 27, 2003 (to be available at the meeting). Please obtain clearance prior to sending.