Welcome to the Year 2002 IMIC Specialty Conferences

IMIC Specialty Conferences

From time to time, the IMIC organization may hold a "Specialty Conference" on a subtopic of VLSI Multilevel Interconnection (ie, dielectrics, conductors, planarization, reliability, simulation & modeling, etc.). These "Specialty Conferences" are held in addition to the annual VMIC meeting, normally held in September. "Specialty Conferences" allow an in-depth look and evaluation of various VMIC sub-areas.
TWO SEPARATE MEETINGS
Marriott Hotel
Santa Clara, California
Feb. 25-Mar. 1, 2002
Hotel Registration
DIELECTRIC/
CONDUCTORS
(Eighth International Conference)
FOR ULSI MULTILEVEL INTERCONNECTION
February 25th
C.M.P. PLANARIZATION
(Seventh International Conference)
FOR ULSI MULTILEVEL INTERCONNECTION
Feb. 27 thru Mar. 1
STATE-OF-THE-ART
SHORT COURSE
CMP Planarization

February 26th

Registration Information Registration Form
http://www.imic.org
HIGHLIGHTS
  • "Recent Developments in Low-k Nanoporous Organosilicate Dielectrics"

    Dr. Willi Volksen,
    IBM Almaden Res. Center
    DCMIC Keynote Address

  • Semiconductor Industry Reps: Needs of CMP in Future

    INTEL: Mansour Moinpour
    MOTOROLA: Janos Farkas
    HEWLETT PACKARD: Michael Monroe
    LSI LOGIC: Peter Burke
    CMP-MIC Keynote Address

  • "High-k Dielectrics: Processing, Properties and Implications for Back-End Integration"

    Dr. Jeff Roeder,
    ATMI Materials
    DCMIC Luncheon

  • "Copper CMP Polishing With k < 2.8: Challenges and Solutions"

    Dr. Jayanthi Pallinti,
    LSI Logic R & D
    CMP-MIC Luncheon

  • DCMIC New ‘Topical Lectures': Low-k & Cu Reliability
  • CMP - SHORT COURSE: Full Day - 8 Expert Lecturers
  • DCMIC: ONLY Selected Oral Talks (all others rejected)
  • CMP-MIC Extended to Three (3) FULL Days