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SHORT COURSE VLSI MULTILEVEL INTERCONNECTION TOWARD NANOELECTRONICS INTERCONNECTION Monday, November 18, 2002 This Short Course will address those issues impacting the future development of ULSI nanoelectronic interconnection toward greater functionality, density and speed. The registration fee includes coffee breaks, luncheon and a visuals booklet. THIS COURSE HAS LIMITED ENROLLMENT, ADVANCE REGISTER EARLY. TOPICAL COVERAGE I. INTRODUCTORY REMARKS 9:15 A.M.Thomas E. Wade II. COPPER INTERCONNECT DEVELOPMENTS ------------------------ III.ADVANCES IN LOW-k & ULTRA LOW-k ASM Corp.; San Jose, CA
V. CHEMICAL MECHANICAL PLANARIZATION:FRIEND OR FOE? 1:45 P.M. David J. Stein Sandia National Labs; Albuquerque, NM
VI. ABRASIVE-FREE POLISHING & CORROSIONCONTROL - DAMASCENE CU PROCESS 2:45 P.M. Seiichi Kondo Selete; Ibaraki-ken, JAPAN ---------------- Coffee Break 3:45 P.M. VII. ADVANCES IN R.F. PASSIVES IN COPPER/ VIII. CLOSING REMARKS 5:00 P.M.
Short Course registration materials may be picked up at the Registration Desk from 7 - 9:30 a.m. on Mon., Nov. 18, 2002. Additional AT-DOOR registrations -- on a space available basis -- will be conducted during this time also.
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