State of the Art Seminar

State of the Art Seminar VLSI MULTILEVEL INTERCONNECTION
STATE-OF-THE-ART SEMINAR
Friday, November 30, 2001
http://www.imic.org

Registration Information Registration Form

This year's state-of-the-art SEMINAR will address those issues associated with current fundamental developments in advancing VLSI/ULSI multilevel interconnection towards greater functionality, density and speed. It will include a review and discussion of those primary topical areas which impact todays multilevel interconnection events as well as project future direction for this critical industry.
A distinguished set of lecturers will participate in this SEMINAR, which is a MUST for all engineers, managers and technicians working on VLSI/ULSI multilevel interconnection. The registration fee includes coffee breaks, luncheon and a visuals booklet.
THIS COURSE HAS LIMITED ENROLLMENT. YOU ARE HIGHLY ENCOURAGED TO ADVANCE REGISTER EARLY.

TOPICAL COVERAGE

I. INTRODUCTORY REMARKS .
Dr. Thomas E. Wade
Seminar Chairman
University of South Florida

8:35 A.M.

II. COPPER INTERCONNECTS:
A. ADVANCE COPPER TECHNOLOGY DEVELOPMENTS
Dr. Chiu H. Ting
Mattson Technology
San Jose, California

8:45 A.M.

III. C.M.P. PLANARIZATION:
A. ADVANCED IN C.M.P. TECHNOLOGY
Dr. Kathleen Perry
Cabot Microelectronics
Aurora, Illinois

9:30 A.M.

Coffee Break 10:15 A.M.

B. C.M.P. MODELING AND SIMULATION DEVELOPMENTS
Dr. Stephen Beaudoin
Arizona State University
Tempe, Arizona

10:30 A.M.

IV. MICROPHOTONICS:
INTERCONNECT ASPECT OF MICRO-PHOTONICS AT MIT
Dr. Jurgen Michel
Massachusetts Inst. of Technology
Cambridge, Massachusetts

11:15 A.M.

Seminar Luncheon - 12:00 P.M.
"THE AMAZING WORLD OF ATOMIC LAYER DEPOSITION (ADL) FOR ULSI"
Dr. Thomas E. Seidel
GENUS CORPORATION
San Jose, California

V. 3-D INTEGRATED CIRCUITS:
THREE-DIMENSIONAL IC's BY WAFER STACKING:
WHY, HOW & WHEN
Dr. Ronald Gutmann
Rensselaer Polytechnical Institute
Troy, New York

1:45 P.M.

VI. OPTICAL PACKAGING:
FIBER OPTIC PACKAGING AND AUTOMATION
Dr. Frank Shi
University of California
Irvine, California

2:30 P.M.

Coffee Break - 3:15 P.M.

VII. THERMAL EFFECTS:
HEAT TRANSFER IN ADVANCED INTERCONNECT SYSTEMS
Dr. Kenneth E. Goodson
Stanford University
Stanford, California

3:30 P.M.

VIII. MEMS:
INTERCONNECT RELATED DEVELOPMENTS IN MEMS
Dr. Dale Hetherington
Sandia National Laboratory
Albuquerque, New Mexico

4:15 P.M.

IX. CLOSING REMARKS

5:00 P.M.

I. INTRODUCTORY REMARKS . Dr. Thomas E. Wade Seminar Chairman University of South Florida	8:35 A.M.
II. COPPER INTERCONNECTS: A. ADVANCE COPPER TECHNOLOGY DEVELOPMENTS Dr. Chiu H. Ting Mattson Technology San Jose, California	8:45 A.M.
III. C.M.P. PLANARIZATION: A. ADVANCED IN C.M.P. TECHNOLOGY Dr. Kathleen Perry Cabot Microelectronics Aurora, Illinois	9:30 A.M.
Coffee Break 10:15 A.M.
B. C.M.P. MODELING AND SIMULATION DEVELOPMENTS Dr. Stephen Beaudoin Arizona State University Tempe, Arizona	10:30 A.M.
IV. MICROPHOTONICS: INTERCONNECT ASPECT OF MICRO-PHOTONICS AT MIT Dr. Jurgen Michel Massachusetts Inst. of Technology Cambridge, Massachusetts	11:15 A.M.
Seminar Luncheon - 12:00 P.M. "THE AMAZING WORLD OF ATOMIC LAYER DEPOSITION (ADL) FOR ULSI" Dr. Thomas E. Seidel GENUS CORPORATION San Jose, California
V. 3-D INTEGRATED CIRCUITS: THREE-DIMENSIONAL IC's BY WAFER STACKING: WHY, HOW & WHEN Dr. Ronald Gutmann Rensselaer Polytechnical Institute Troy, New York	1:45 P.M.
VI. OPTICAL PACKAGING: FIBER OPTIC PACKAGING AND AUTOMATION Dr. Frank Shi University of California Irvine, California	2:30 P.M.
Coffee Break - 3:15 P.M.
VII. THERMAL EFFECTS: HEAT TRANSFER IN ADVANCED INTERCONNECT SYSTEMS Dr. Kenneth E. Goodson Stanford University Stanford, California	3:30 P.M.
VIII. MEMS: INTERCONNECT RELATED DEVELOPMENTS IN MEMS Dr. Dale Hetherington Sandia National Laboratory Albuquerque, New Mexico	4:15 P.M.
IX. CLOSING REMARKS	5:00 P.M.