Copper/Low-K Short Course
SPECIAL SHORT COURSE
VLSI MULTILEVEL INTERCONNECTION
COPPER/ULTRA LOW-k PROCESSES

Tuesday, November 27, 2001

http://www.imic.org
Registration Information Registration Form

Due to the importance that advance COPPER metallization coupled with ULTRA LOW-k dielectrics systems have in multilevel interconnection, we are again offering this one-day short course on advance metallization systems for our attendees. The registration fee includes coffee breaks, luncheon and a visuals booklet. THIS COURSE HAS LIMITED ENROLLMENT, ADVANCE REGISTER EARLY.

TOPICAL COVERAGE

I. INTRODUCTORY REMARKS
  • Thomas E. Wade

9:15 A.M.
II. BARRIER/CONTACT/ADHESION LAYERS FOR
SUBMICRON METALLIZATION
  • Max Biberger
  • Supercritical Systems; Fremont, CA

9:30 A.M.

Coffee Break - 10:30 A.M.

III. COPPER DEPOSITION TECHNIQUES:
  • Max Biberger
  • Supercritical Systems; Fremont, CA

10:45 A.M.
Luncheon - 12:00 P.M.

"INTEGRATION OF POROUS LOW-k DIELECTRICS IN ULSI"

Dr. Rodney Kistler
LAM RESEARCH CORP.
Fremont, California

IV. ADVANCES IN ULTRA LOW-k DIELECTRIC SYSTEMS
  • Ravi K. Laxman
  • ATMI; San Jose, CA

1:45 P.M.
V. CMP OF COPPER/LOW-k SYSTEMS
  • Kapila Wijekoon
  • Applied Materials; Santa Clara, CA

2:45 P.M.

Coffee Break - 3:45 P.M.

VI. MODELING & SIMULATION OF COPPER/ LOW-k SYSTEMS
  • Valeriy Sukharev
  • LSI Logic Corp; Santa Clara, CA.

4:00 P.M.
VII. CLOSING REMARKS 5:00 P.M.

Tutorial registration materials may be picked up at the Registration Desk from 7 - 9:30 a.m. on Mon., Sept. 24, 2001.

Additional registrations -- on a space available basis -- will be conducted during this time also. Come early to avoid lines.