CMP Short Course
SPECIAL SHORT COURSE
VLSI MULTILEVEL INTERCONNECTION
ADVANCE CHEMICAL-MECHANICAL-PLANARIZATION PROCESSES

Tuesday, November 27, 2001

http://www.imic.org
Registration Information Registration Form

Due to the importance that advance Chemical-Mechanical-Planarization processes have in modern day multilevel interconnection, we are offering this one-day short course for our attendees. The registration fee includes coffee breaks, luncheon and a visuals booklet. THIS COURSE HAS LIMITED ENROLLMENT, ADVANCE REGISTER EARLY.

TOPICAL COVERAGE

I. INTRODUCTORY REMARKS
  • Thomas Wade

9:30 A.M.
II. COPPER SLURRY DEVELOPMENT
  • Yuzhuo Li
  • Clarkson University; Potsdam, N.Y.

9:45 A.M.

Coffee Break - 10:45 A.M.

III. DIELECTRIC CMP PROCESSES
  • Paul Feeney
  • Cabot Microelectronics.; Aurora, Illinois

11:00 A.M.

Luncheon - 12:00 P.M.

"INTEGRATION OF POROUS LOW-k DIELECTRICS IN ULSI"

Dr. Rodney Kistler
LAM RESEARCH CORP.
Fremont, California

IV. METAL CMP PROCESSES
  • David Stein
  • Sandia National Labs; Albuquerque, N.M.

1:45 P.M.
V. CMP PAD CONDITIONING
  • James Sung
  • Kinik Company; Taiwan, R.O.C.

2:45 P.M.

Coffee Break - 3:45 P.M.

VI. ADVANCES IN CMP METROLOGY U
  • Anantha Sethurama
  • KLA-Tencor; San Jose, CA.

4:00 P.M.
VII. CLOSING REMARKS
 5:00 P.M.

Short course registration materials may be picked up at the Registration Desk from 7 - 9:30 AM, Mon., Sept. 24, 2001.

Additional registrations - on a space available basis - will be conducted during this time also. Come early to avoid lines