CHEMICAL-MECHANICAL
PLANARIZATION FOR ULSI MULTILEVEL INTERCONNECTION

- SHORT COURSE -

Tuesday, March 6, 2001

Registration Information Registration Form

http://www.imic.org

This year's comprehensive Chemical Mechanical Planarization Short Course consist of a FULL DAYS ACTIVITIES and will address those issues associated with current fundamental developments in advancing ULSI multilevel interconnection towards greater functionality, density and speed. It will include a review and discussion of those CMP primary topical areas which impact todays multilevel interconnection activities as well as project future direction for this critical industry. A distinguished set of lecturers will participate in this CMP SHORT COURSE, which is a MUST for all engineers, managers and technicians working on VLSI/ULSI multilevel interconnection.

The registration fee includes coffee breaks, luncheon and a visuals booklet.

THIS COURSE HAS LIMITED ENROLLMENT. YOU ARE HIGHLY ENCOURAGED TO ADVANCE REGISTER EARLY.

TOPICAL COVERAGE

  • I. INTRODUCTORY REMARKS

    • 8:35 A.M.
    Thomas E. Wade
    Short Course Chairman
    University of South Florida,
    Tampa, Florida


  • II. DEVELOPMENTS IN CMP DIELECTRIC PROCESSES

    • 8:45 A.M.
    Paul Feeney
    Cabot Corp.,
    Aurora, Illinois


  • III. DEVELOPMENTS IN CMP METAL PROCESSES.
    		• 9:30 A.M.
    David Stein
    Sandia National Labs
    Albuquerque, New Mexico
    Coffee Break 10:15 A.M.


  • IV. ELECTROCHEMICAL ASPECTS OF CMP PROCESSES
    		• 10:30 A.M.
    Srini Raghaven
    University of Arizona,
    Tucson, Arizona


  • V. ADVANCES IN CHEMICAL MECHANICAL
    PLANARIZATION METROLOGY
    		• 11:15 A.M.
    Anantha Sethurama
    KLA-Tencor Corp.,
    San Jose, California


    Short Course Luncheon - 12:00 P.M.

    "ELECTROPLATING AND CMP OF COPPER INTERCONNECTS"
    Dr. Tohru Hara
    HOSEI UNIVERSITY
    Tokyo, Japan



  • VI. MODELING AND SIMULATION ADVANCES
    IN CMP PROCESSES
    		• 1:45 P.M.
    Duane Boning
    Massachusetts Inst.of Technology,
    Cambridge, Massachusetts


  • VII. CHEMICAL MECHANICAL PLANARIZATION
    INTEGRATION ISSUES
    		• 2:30 P.M
    Katia Devriendt
    IMEC,
    Leuven, Belgium
    Coffee Break 3:15 P.M.


  • VIII. CHEMICAL MECHANICAL PLANARIZATION
    (AND POST-CMP CLEANING) CONSUMABLES
    		• 3:30 P.M
    Ara Philipossian
    Intel Corp,
    Santa Clara, California
    (On sabbatical at Univ. of Arizona)


  • IX. C.M.P. FUTURE NEEDS AND NEW APPLICATIONS
    		• 4:15 P.M.
    Dale Hetherington
    Sandia National Labs,
    Albuquerque, New Mexico


  • VIII. CLOSING REMARKS
    		• 5:00 P.M.

    Short Course registration materials may be picked up at the Registration Desk from 7 - 10 A.M. on Tues., March 6, 2001. Additional registration - on a space available basis - will be conducted during this time as well.