SPECIAL SHORT COURSE
VLSI MULTILEVEL INTERCONNECTION
ADVANCE METALLIZATION PROCESSES

Monday, June 26, 2000
Registration Information Registration Form

Due to the importance that advance COPPER metallization systems have in multilevel interconnection, we have been requested to again put together the following one-day short course emphasizing advance metallization processes for our attendees.

The registration fee includes coffee breaks, luncheon and a visuals booklet.

THIS COURSE HAS LIMITED ENROLLMENT, ADVANCE REGISTER EARLY.

TOPICAL COVERAGE

  • I. INTRODUCTORY REMARKS - 9:15 A.M.
    Thomas E. Wade

  • II. COPPER DEPOSITION TECHNIQUES:PVD/CVD/ELECTROPLATING/ETC.- 9:30 A.M.
    Max Biberger
    Supercritical Systems; Fremont, CA

    Coffee Break - 10:30 A.M.

  • III. BARRIER/CONTACT/ADHESION LAYERS FOR SUBMICRON METALLIZATION - 10:45 A.M.
    Max Biberger
    Supercritical Systems; Fremont, CA

    Luncheon - 12:00 P.M.

    "CRITICAL ANALYSIS AND MANUFACTURABILITY OF ADVANCED INTERCONNECTS"
    Dr. John H. Givens
    ADVANCED TECHNOLOGY GROUP
    San Antonio, Texas

  • IV. CHEMISTRY OF METAL CMP PROCESSES - 1:45 P.M.
    Srini Raghavan
    University of Arizona; Tucson, AZ

  • V. COPPER INTEGRATION/DEFECTS AND YIELD - PART I - 2:45 P.M.
    Ernie Levine, Parth Dave & Tom Houghton
    IBM Microelectronics; Hopewell Jct., NY

    Coffee Break - 3:45 P.M.

  • VI. COPPER INTEGRATION/DEFECTS AND YIELD - PART II - 4:00 P.M.
    Ernie Levine, Tom Houghton & Parth Dave
    IBM Microelectronics; Hopewell Jct., N.Y.

  • VII. CLOSING REMARKS 5:00 P.M.

Tutorial registration materials may be picked up at the Registration Desk from 7 - 9:30 a.m. on Mon., June 26, 2000.

Additional registrations -- on a space available basis -- will be conducted during this time also. Come early to avoid lines.