- "300mm/Copper/Low-k Convergence: Timing, Trend"
Dr. Robert Castellano; The Information Network
Keynote Address
- "Japan's Industrial Progress in 300 mm Fabrication"
Dr. Shigeru Kobayashi; Gen. Deputy; Selete
Keynote Address
- "Super Cooled Unity-k Dielectric System for ULSI"
Dr. Thomas E. Wade; Prof.; Univ. S. Florida
VMIC Awards Luncheon
- "Integration and Reliability of Low-k Dielectrics"
Dr. Wei William Lee, R&D Manager; TSMC
State-of-Art Seminar Luncheon
- "Critical Analysis and Manufacturability of Advance
Interconnects"
Dr. John H. Givens; Advanced Tech. Gp.
Metals & CMP Short Course Luncheon
- VMIC Advance Metals & CMP Short Courses,Conference,
plus SUPERB State-of-the-Art Seminar
- SESSION IV-A - 5:00 - 6:30 P.M.
VLSI MULTILEVEL INTERCONNECTION VMIC CONFERENCE RECEPTION
The VMIC Conference Reception will be held in the Exhibit Hall area and
will include plenty of Hor d'oeuvres and beverage (cash bar will be
provided). This will be the ideal time to catch up on the news of
colleagues and former acquaintances. Plan now to participate in this
important event.
- Winners of exhibitor door prizes to be announced on Wednesday
afternoon, June 28, at 2:45 p.m. in the Exhibit Hall. Persons must be
registered attendees and present to win.
-
OUTSTANDING PAPER/POSTER PRESENTATIONS
The VMIC Outstanding Paper Award for 1999 is presented to the paper
entitled " Integration of HSQ in a Sub-0.20 micron CMOS Technology With
Unlanded Via Architecture" by C. Lair, G. Pare, F. Andre, C. Maddalon,
M. Haond; ST MICRO; Crolles, FRANCE; V. DeJonghe, S. Louwers; PHILIPS
SEMI; and R. Pantel, G. Auvert; CNET TELECOM; Meylan, FRANCE.
The VMIC Outstanding Poster Paper Award for 1999 is presented to the
poster paper entitled "Test Methods for Assessing Adhesion of Integrated
Circuit Thin Film During CMP" by S. Towle and M. Moinpour; INTEL
CORP; Santa Clara, CA.
- This year's VMIC includes 120 Technical Papers.
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