DIELECTRICS FOR ULSI MULTILEVEL INTERCONNECTION

---SHORT COURSE---

Tuesday, February 29, 2000

Registration and Information

The purpose of this SHORT COURSE is to provide an overview of current research activities for those issues impacting the on-chip DIELECTRICS used in the VLSI/ULSI multilevel interconnection and related technologies.

A distinguished set of lecturers will participate in this SHORT COURSE which is a MUST for all engineers, managers and technicians working on VLSI multilevel interconnection. The registration includes coffee breaks, luncheon and a visual booklet.

THIS COURSE HAS LIMITED ENROLLMENT, YOU ARE HIGHLY ENCOURAGED TO ADVANCE REGISTER EARLY

Luncheon 12:00 PM

"RECENT ADVANCES IN LOW-k MATERIALS AND LOW-k INTEGRATION"
Dr. Maximilian A. Biberger
SUPERCRITICAL SYSTEMS, INC.
Fremont, California

  1. 1:05 PM - INTRODUCTORY REMARKS
    Dr. Thomas E. Wade
    Short Course Chairman

  2. 1:10 PM - INTEGRATION AND RELIABILITY OF DIELECTRICS
    Dr. Suzette Pangrle
    AMD Corp.; Sunnyvale, CA

  3. 2:05 PM - INORGANIC DIELECTRIC
    Dr. Nigel P. Hacker
    Allied Signal; Santa Clara, CA

    3:00 --Coffee Break--

  4. 3:15 PM - ORGANIC DIELECTRICS
    Dr. Devendra Kumar
    FSI International; Fremont, CA

  5. 4:10 PM - ADVANCES IN POROUS DIELECTRICS
    Dr. Willi Volksen
    IBM Almader Res. Ctr.; San Jose, CA

  6. 5:05 PM - IMPLEMENTATION OF LOW-k AND FUTURE TRENDS
    Dr. Carlye Case
    Bell Labs/Lucent Tech; Murry Hill, NJ

  7. 6:00 PM - CLOSING REMARKS
    Dr. Thomas E. Wade

Short Course registration materials may be picked up at the Registration Desk from 10 - 12:00 noon on Tues., Feb. 29.

Additional registration - on a space available basis - will be conducted at this time as well.