Welcome to the Year 2000 IMIC Specialty Conferences

IMIC Specialty Conferences

From time to time, the IMIC organization may hold a "Specialty Conference" on a subtopic of VLSI Multilevel Interconnection (ie, dielectrics, conductors, planarization, reliability, simulation & modeling, etc.). These "Specialty Conferences" are held in addition to the annual VMIC meeting, normally held in September. "Specialty Conferences" allow an in-depth look and evaluation of various VMIC sub-areas.
TWO SEPARATE MEETINGS
Marriott Hotel
Santa Clara, California
Feb. 28 - March 3, 2000
Hotel Registration
DIELECTRICS
(Sixth International Conference)
FOR ULSI MULTILEVEL INTERCONNECTION
February 28th and 29th
C.M.P. PLANARIZATION
(Fifth International Conference)
FOR VLSI MULTILEVEL INTERCONNECTION
March 2nd and March 3rd
TWO STATE-OF-THE-ART
SHORT COURSES
Dielectrics
February 29th
Planarization
March 1st

Registration Information Registration Form
HIGHLIGHTS:
  • DUMIC Keynote Address: "Heat Transfer in Advanced Interconnect Systems"
    Dr. Kenneth E. Goodson, Stanford University

  • CMP-MIC Keynote Address: CMP Corporate Officers "Vision of CMP Future"
    Richard Faubert, CEO, SpeedFam-IPEC;
    Jim Burke, CEO, Strasbaugh;
    James Bagley, CEO, Lam Research;
    Chris Smith, Corp VP, Applied Materials
    John Aldeborgh, President Ebara America

  • DUMIC Luncheon: "Strategic & Tactical Impact of Earthquakes in Taiwan"
    Dr. Siva Sivaram,
    Matrix Semiconductor

  • CMP-MIC Luncheon: "CMP Flow Visualization & Fluid Dynamic Meas."
    Drs. Ara Philipossian & Mansour Moinpour, Intel

  • Dielectrics & CMP State-of-the-Art SHORT COURSES

  • DUMIC & CMP-MIC includes over 140 Technical Papers by Leading Experts